Si Ingot Slicing Machine

EMUM-DEU-Si-ingot-wafer-dilimleme

Brand / Model:

Maiztech Co. EQ-STX-1202

Features:

Travel Distance (Z): 0.01 – 300mm
Feeding Speed (Z): 0.01 – 30 mm/min
Travel Distance (Y): 0.01 – 300 mm
Cutting Width (Y): 0.01 – 300 mm
Stage Rotation (R): 0.01 – 360 degree
Diamond Saw: Ø 0.3mm x 150 m

Aim:

It is used to produce Si wafers from Si ingots by slicing them with desired parameters.