Si Wafer Cutting Machine

emum-wafer-kesme

Brand / Model

Logitech APD-11

Features

Max. depth of cut: 55 mm
Max. length of cut: 102 mm
Min. rotational speed: 100 rpm
Max. rotational speed: 5000 rpm
Min. feed rate: 0.01 mm/sec
Max. feed rate: 2.00 mm/sec
Positional accuracy: 5 micron

Aim

It is used for circular and peripheral cutting of Si wafers with a single unit.

Terms of Sample Delivery:

 

Contact:

Click here for EMUM price list.

Click here for letter of application for industrial service.

Authorized: Cesim Narmanoğlu – Sample Acceptance Unit | Phone: +90 232 301 90 10 | E-mail: cesim.narmanoglu@deu.edu.tr

EMUM Secretary | Phone: +90 232 301 90 01 | E-mail: emum@deu.edu.tr