Si Wafer Cutting Machine

emum-wafer-kesme

Brand / Model

Logitech APD-11

Features

Max. depth of cut: 55 mm
Max. length of cut: 102 mm
Min. rotational speed: 100 rpm
Max. rotational speed: 5000 rpm
Min. feed rate: 0.01 mm/sec
Max. feed rate: 2.00 mm/sec
Positional accuracy: 5 micron

Aim

It is used for circular and peripheral cutting of Si wafers with a single unit.